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1. product profile 1.1 general description planar maximum efficiency general applicatio n (mega) schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a sod123w small and flat lead surface-mounted device (smd) plastic package. 1.2 features and benefits ? average forward current: i f(av) 1a ? reverse voltage: v r 60 v ? low forward voltage ? high power capability due to clip-bond technology ? aec-q101 qualified ? small and flat lead smd plastic package 1.3 applications ? low voltage rectification ? high efficiency dc-to-dc conversion ? switch mode power supply (smps) ? reverse polarity protection ? low power consumption applications 1.4 quick reference data [1] device mounted on a ceramic p rinted-circuit board (pcb), al 2 o 3 , standard footprint. PMEG6010ER 1 a low v f mega schottky barrier rectifier rev. 01 ? 9 march 2010 product data sheet table 1. quick reference data t j =25 c unless otherwise specified. symbol parameter conditions min typ max unit i f(av) average forward current square wave; = 0.5; f = 20 khz t amb 110 c [1] --1a t sp 140 c--1a v r reverse voltage - - 60 v v f forward voltage i f = 1 a - 460 530 mv i r reverse current v r =60v - 30 60 a
PMEG6010ER_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 9 march 2010 2 of 14 nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier 2. pinning information [1] the marking bar indicates the cathode. 3. ordering information 4. marking 5. limiting values table 2. pinning pin description simplified outline graphic symbol 1 cathode [1] 2 anode 2 1 sym00 1 12 table 3. ordering information type number package name description version PMEG6010ER - plastic surface-mounted package; 2 leads sod123w table 4. marking codes type number marking code PMEG6010ER bb table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v r reverse voltage t j =25 c-60v i f(av) average forward current square wave; = 0.5; f=20khz t amb 110 c [1] -1a t sp 140 c-1a i fsm non-repetitive peak forward current square wave; t p =8ms [2] -50a p tot total power dissipation t amb 25 c [3] [4] -0.57w [3] [5] -0.95w [1] [3] -1.8w
PMEG6010ER_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 9 march 2010 3 of 14 nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier [1] device mounted on a ceramic pcb, al 2 o 3 , standard footprint. [2] t j =25 c prior to surge. [3] reflow soldering is the only recommended soldering method. [4] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [5] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1 cm 2 . 6. thermal characteristics [1] for schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses p r are a significant part of the total power losses. [2] reflow soldering is the only recommended soldering method. [3] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [4] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1 cm 2 . [5] device mounted on a ceramic pcb, al 2 o 3 , standard footprint. [6] soldering point of cathode tab. t j junction temperature - 150 c t amb ambient temperature ? 55 +150 c t stg storage temperature ? 65 +150 c table 5. limiting values ?continued in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] [2] [3] - - 220 k/w [4] - - 130 k/w [5] --70k/w r th(j-sp) thermal resistance from junction to solder point [6] --18k/w
PMEG6010ER_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 9 march 2010 4 of 14 nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier fr4 pcb, standard footprint fig 1. transient thermal impedance from junction to am bient as a function of pu lse duration; typical values fr4 pcb, mounting pad for cathode 1 cm 2 fig 2. transient thermal impedance from junction to am bient as a function of pu lse duration; typical values 006aab362 10 1 10 2 10 3 z th(j-a) (k/w) 10 ? 1 t p (s) 10 ? 3 10 2 10 3 10 1 10 ? 2 10 ? 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 006aab363 10 1 10 2 10 3 z th(j-a) (k/w) 10 ? 1 t p (s) 10 ? 3 10 2 10 3 10 1 10 ? 2 10 ? 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0
PMEG6010ER_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 9 march 2010 5 of 14 nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier 7. characteristics ceramic pcb, al 2 o 3 , standard footprint fig 3. transient thermal impedance from junction to am bient as a function of pu lse duration; typical values 006aab364 10 1 10 2 10 3 z th(j-a) (k/w) 10 ? 1 t p (s) 10 ? 3 10 2 10 3 10 1 10 ? 2 10 ? 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 table 7. characteristics t j =25 c unless otherwise specified. symbol parameter conditions min typ max unit v f forward voltage i f = 0.1 a - 320 370 mv i f = 0.7 a - 430 490 mv i f = 1 a - 460 530 mv i r reverse current v r =5v - 1.2 - a v r =10v - 1.7 - a v r =60v - 30 60 a c d diode capacitance f = 1 mhz v r = 1 v - 120 - pf v r =10v - 40 - pf
PMEG6010ER_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 9 march 2010 6 of 14 nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier (1) t j = 150 c (2) t j = 125 c (3) t j =85 c (4) t j =25 c (5) t j = ? 40 c (1) t j = 125 c (2) t j =85 c (3) t j =25 c (4) t j = ? 40 c fig 4. forward current as a function of forward voltage; typical values fig 5. reverse current as a function of reverse voltage; typical values f=1mhz; t amb =25 c fig 6. diode capacitance as a function of reverse voltage; typical values 006aab890 10 ? 2 10 ? 3 1 10 ? 1 10 i f (a) 10 ? 4 v f (v) 0.0 0.8 0.6 0.2 0.4 (1) (2) (3) (4) (5) 006aab891 v r (v) 060 40 20 10 ? 2 10 ? 3 10 ? 4 10 ? 5 10 ? 6 10 ? 7 10 ? 8 i r (a) 10 ? 9 (4) (1) (2) (3) 006aab892 v r (v) 060 40 20 100 150 50 200 250 c d (pf) 0
PMEG6010ER_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 9 march 2010 7 of 14 nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier t j = 150 c (1) =0.1 (2) =0.2 (3) =0.5 (4) =1 t j = 125 c (1) =1 (2) =0.9 (3) =0.8 (4) =0.5 fig 7. average forward power dissipation as a function of average forward current; typical values fig 8. average reverse power dissipation as a function of reverse voltage; typical values fr4 pcb, standard footprint t j = 150 c (1) =1; dc (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz fr4 pcb, mounting pad for cathode 1 cm 2 t j = 150 c (1) =1; dc (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz fig 9. average forward current as a function of ambient temperature; typical values fig 10. average forward current as a function of ambient temperature; typical values i f(av) (a) 0.0 1.5 1.0 0.5 006aab893 0.7 p f(av) (w) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 (1) (2) (3) (4) 006aab894 v r (v) 060 40 20 0.4 0.2 0.6 0.8 p r(av) (w) 0.0 (1) (2) (3) (4) t amb ( c) 175 125 25 150 100 50 075 006aab895 0.8 0.4 1.2 1.6 i f(av) (a) 0.0 (1) (2) (3) (4) t amb ( c) 175 125 25 150 100 50 075 006aab896 0.8 0.4 1.2 1.6 i f(av) (a) 0.0 (1) (2) (3) (4)
PMEG6010ER_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 9 march 2010 8 of 14 nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier ceramic pcb, al 2 o 3 , standard footprint t j = 150 c (1) =1; dc (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz t j = 150 c (1) =1; dc (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz fig 11. average forward current as a function of ambient temperature; typical values fig 12. average forward current as a function of solder point temperature; typical values t amb ( c) 175 125 25 150 100 50 075 006aab897 0.8 0.4 1.2 1.6 i f(av) (a) 0.0 (1) (2) (3) (4) t sp ( c) 175 125 25 150 100 50 075 006aab898 0.8 0.4 1.2 1.6 i f(av) (a) 0.0 (1) (2) (3) (4)
PMEG6010ER_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 9 march 2010 9 of 14 nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier 8. test information the current ratings for the ty pical waveforms as shown in figure 9 , 10 , 11 and 12 are calculated according to the equations: with i m defined as peak current, at dc, and with i rms defined as rms current. 8.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q101 - stress test qualificat ion for discrete semiconductors , and is suitable for use in automotive applications. 9. package outline fig 13. duty cycle definition t 1 t 2 p t 006aaa812 duty cycle = t 1 t 2 i fav () i m = i rms i fav () = i rms i m = fig 14. package outline sod123w 08-11-06 dimensions in mm 2.8 2.4 3.7 3.3 1.05 0.75 1.9 1.5 1 2 0.6 0.3 0.22 0.10 1.1 0.9
PMEG6010ER_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 9 march 2010 10 of 14 nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier 10. packing information [1] for further information and the avai lability of packing methods, see section 14 . 11. soldering table 8. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 3000 PMEG6010ER sod123w 4 mm pitch, 12 mm tape and reel -115 reflow soldering is the only recommended soldering method. fig 15. reflow soldering footprint sod123w 2.9 2.8 4.4 1.6 2.1 1.2 (2 ) 1.1 (2 ) solder lands solder resist occupied area solder paste 1.1 (2 ) 1.2 (2 ) sod123w_ fr dimensions in mm
PMEG6010ER_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 9 march 2010 11 of 14 nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier 12. revision history table 9. revision history document id release date data sheet status change notice supersedes PMEG6010ER_1 20100309 product data sheet - -
PMEG6010ER_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 9 march 2010 12 of 14 nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 13.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qualified for use in automotive applications. the product is not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be ex pected to result in personal injury, death or severe property or environmental dam age. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer?s third party customer(s) (hereinafter both referred to as ?application?). it is customer?s sole responsibility to check whether the nxp semiconductors product is suitable and fit for the application planned. customer has to do all necessary testing for the application in order to avoid a default of the application and the product. nxp semiconducto rs does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
PMEG6010ER_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 9 march 2010 13 of 14 nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier 13.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors PMEG6010ER 1 a low v f mega schottky barrier rectifier ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 9 march 2010 document identifier: PMEG6010ER_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . 9 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 packing information . . . . . . . . . . . . . . . . . . . . 10 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 12 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 contact information. . . . . . . . . . . . . . . . . . . . . 13 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

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